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常压烧结碳化硅陶瓷的表面裂纹对其力学性能的影响
作者:杨晓 黄政仁 刘学建 
单位:中国科学院上海硅酸盐研究所 高性能陶瓷和超微结构国家重点实验室 上海200050 
关键词:碳化硅陶瓷 表面裂纹尺寸 表面裂纹倾斜角 弯曲强度 
分类号:TQ174.75
出版年,卷(期):页码:2014,42(7):841-845
DOI:10.7521/j.issn.0454-5648.2014.07.05
摘要:

以常压烧结碳化硅陶瓷材料(SSiC陶瓷)为研究对象,开展陶瓷表面裂纹及其对力学性能影响的研究。结果表明,当裂纹尺寸小于40μm时,SSiC陶瓷的弯曲强度迅速降低55%;裂纹尺寸约50μm以后,弯曲强度的下降趋于平缓。通过曲线拟合及实验验证得到了弯曲强度对不同裂纹尺寸的关系式。通过对裂纹方向的研究,建立了裂纹方向对材料弯曲强度产生影响的模型。

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Silicon carbide ceramics were prepared via solid-phase sintering as SSiC. The influence of surface cracks on the corresponding bending strength was investigated. The results show that the strength of SSiC ceramic is decreased by 55% when the crack size is<40μm, and the decreasing trend of bending strength becomes slower in the presence of the longer cracks. A fitted equation was proposed to calculate the bending strength as a function of crack size. The inclined angle of surface crack was also discussed, and a corresponding model was established to analyze the influence of crack inclined angle on the bending strength.

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基金项目:
作者简介:
通信作者:杨 晓(1987—),女,博士。
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