硅酸盐学报

单颗磨粒作用下硼硅酸盐玻璃的亚表面静态裂纹

单位：1.南京航空航天大学机电学院江苏省精密与微细制造技术重点实验室南京210016 2．江苏中晶光电科技有限公司江苏常州213164

分类号：TQ171.684

出版年,卷(期):页码：2014,42(9):1161-1166

DOI：10.7521/j.issn.0454－5648.2014.09.13

摘要：

利用Vickers压痕法模拟研磨抛光过程中单颗磨粒作用于K9(硼硅酸盐玻璃)工件表面过程，采用HF截面腐蚀法测量金刚石压头压入过程中的裂纹深度，探索裂纹深度与载荷和压头压入深度之间的关系，借助有限元软件ANSYS/LS－DYNA分析不同载荷下裂纹的产生和发展过程。结果表明：在0.098～0.490N载荷范围内，裂纹以横向裂纹为主；在0.49～2.94N载荷范围内，裂纹主要为纵向裂纹，少量压坑周围出现多条明显裂纹；在2.94～9.80N载荷范围内，亚表面裂纹主要为纵向裂纹。不同载荷下K9玻璃亚表面裂纹层的深度为1.4～87.2μm；数值模拟的裂纹层深度为3.5～107.5μm。

The process of single diamond grit acting on the K9 (borosilicate glass) workpiece surface in the process of grinding and polishing was simulated by Vickers indentation method. The crack depth of the surface occurred in the diamond head pressing was measured by HF acid section corrosion method. The relation between the crack depth and the load, as well as the pressing depth of the pressure head were investigated. The generation and development process of cracks under different loads were also analyzed by using ANSYS/LS－DYNA. The results show that the cracks are mainly the transverse cracks in the load range of 0.098－0.490N, the cracks are mainly the longitudinal crack in the load range of 0.49－2.94N, due to the massive cracks around a few of pit, and the subsurface cracks are mainly the longitudinal cracks in the load range of 2.94－9.80N. The depth of subsurface crack layer of K9 glass under different loads is 1.4－87.2μm, and the crack depth predicted by numerical simulation is 3.5－107.5μm.

基金项目：

国家自然科学基金(51175260)和中央高校基本科研业务费专项资金(NP2012506)资助项目。

作者简介：

第一作者：戴子华(1980—)，男，博士研究生。通信作者：朱永伟(1967—)，男，教授。

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